Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm

2019-07-18T12:59:52Z (GMT) by Mengying Fan
Data accompanied with the paper 'Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm'. Figure 1 is the original C-scan SAM image of the FA10 flip chip sample. Table 1 shows the numerical values of the features.

Categories

Keyword(s)

License

CC BY 4.0